Semiconductor device having circuit board to which contact part is bonded

A semiconductor device, comprising:

• a substrate which includes a circuit board and an insulating plate on which the circuit board is formed;
• and
• a contact part having a cylindrical hollow hole therein, and open ends, one of the open ends being bonded to a bonding area on a front surface of the circuit board via a bonding material, the contact part having a first plating provided at a contact area thereof, wherein
• the circuit board has a second plating provided at the bonding area thereof, to which the contact part at the contract area is bonded via a bonding material,
• the second plating is made of a nickel alloy containing phosphorus, and
• the first plating is made of nickel or a nickel alloy containing phosphorus, a phosphorus content of a material of the first plating being less than a phosphorus content of a material of the second plating.