Radio frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori Uejima
Life of this patent
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Abstract
A radio frequency module includes a mounting substrate, a low-noise amplifier including an amplifying element and amplifying a radio frequency signal, and an impedance matching circuit including an integrated first inductor, in which the first inductor is connected to an input terminal of the low-noise amplifier, the low-noise amplifier and the impedance matching circuit are laminated in a direction perpendicular to a main surface of the mounting substrate, and a first multilayer body on which the low-noise amplifier and the impedance matching circuit are laminated is mounted on the main surface.
Claims17
A radio frequency module comprising:
- a mounting substrate;
- a low-noise amplifier that includes an amplifying element and that amplifies a radio frequency signal;
- a power amplifier that amplifies a power of a radio frequency signal;
- a third inductor connected to an output terminal of the power amplifier and mounted on the main surface without being laminated with the power amplifier;
- and
- a first integrated passive element including an integrated first inductor,
- wherein the first inductor is connected to an input terminal of the low-noise amplifier,
- the low-noise amplifier and the first integrated passive element are laminated in a direction perpendicular to a main surface of the mounting substrate, and
- a first multilayer body in which the low-noise amplifier and the first integrated passive element are laminated is mounted on the main surface.
A radio frequency module comprising:
- a mounting substrate;
- a low-noise amplifier that includes an amplifying element and that amplifies a radio frequency signal;
- and
- a first integrated passive element including an integrated first inductor,
- wherein the first inductor is connected to an input terminal of the low-noise amplifier,
- the low-noise amplifier and the first integrated passive element are laminated in a direction perpendicular to a main surface of the mounting substrate, and
- a first multilayer body in which the low-noise amplifier and the first integrated passive element are laminated is mounted on the main surface,
- wherein the first integrated passive element is arranged between the mounting substrate and the low-noise amplifier in a cross-sectional view of the mounting substrate.
Dependencies are inferred from the claim text.