RFIC having coaxial interconnect and molded layer
AssigneeIntel Corporation
InventorsSrinivas V. Pietambaram, Rahul N. Manepalli, Kristof Kuwawi Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing
Life of this patent
Estimating the term…
Abstract
Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.
Claims20
A radio frequency integrated circuit, comprising:
- a die including a die pad on a die face;
- a redistribution layer over the die, wherein the redistribution layer includes a coaxial interconnect extending from the die pad orthogonal to the die face, and wherein the die pad is between the die face and the redistribution layer;
- a molded layer over the redistribution layer, wherein the molded layer includes a molding compound;
- and
- an antenna including a first antenna patch electrically coupled to the coaxial interconnect, and a second antenna patch mounted on the molded layer.
A semiconductor package, comprising:
- a package substrate including an antenna including a first antenna patch, and a second antenna patch, a molded layer between the first antenna patch and the second antenna patch, wherein the molded layer includes a molding compound, and a redistribution layer over the molded layer, wherein the redistribution layer includes a coaxial interconnect extending orthogonal to the molded layer and electrically coupled to the first antenna patch;
- and a die mounted on the package substrate, wherein the die includes a die pad on a die face, the die pad electrically coupled to the coaxial interconnect, and wherein the die pad is between the die face and the redistribution layer.
A method, comprising:
- mounting a die on a carrier substrate, wherein the die includes a die pad on a die face;
- forming a redistribution layer over the die pad, wherein the die pad is between the die face and the redistribution layer, wherein the redistribution layer includes a coaxial interconnect, wherein the coaxial interconnect includes a signal trace extending from the die pad orthogonal to the die face, and a shield conductor surrounding the signal trace;
- molding a molded layer over the die;
- and
- forming an antenna, wherein the antenna includes a first antenna patch electrically coupled to the coaxial interconnect and a second antenna patch on the molded layer.
Dependencies are inferred from the claim text.