Semiconductor package and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu
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Abstract
A semiconductor package includes a first die and a second die. The first die includes a first spiral section and first bonding metallurgies of an inductor. The first bonding metallurgies are connected to the first spiral section. The second die is bonded to the first die. The second die includes a second spiral section and second bonding metallurgies of the inductor. The second bonding metallurgies are connected to the second spiral section. The inductor extends from the first die to the second die.
Claims20
A semiconductor package, comprising:
- a first die, comprising a first spiral section and first bonding metallurgies of an inductor, wherein the first bonding metallurgies are connected to the first spiral section, the first spiral section includes a first coil and a second coil located at different level heights, and the first coil and the second coil are made of different materials;
- and
- a second die bonded to the first die, comprising a second spiral section and second bonding metallurgies of the inductor, wherein the second bonding metallurgies are connected to the second spiral section, and the inductor extends from the first die to the second die.
A semiconductor package, comprising:
- a first die, comprising:
- a first semiconductor substrate;
- a first interconnection structure disposed on the first semiconductor substrate;
- and
- a first bonding structure over the first interconnection structure;
- a second die, comprising:
- a second semiconductor substrate;
- a second interconnection structure disposed on the second semiconductor substrate;
- and
- a second bonding structure over the second interconnection structure, wherein the first bonding structure is physically in contact with the second bonding structure;
- and
- an inductor, comprising a first winding portion, a second winding portion, a third winding portion, and a fourth winding portion connected to each other, wherein the first winding portion is embedded in the first interconnection structure, the second winding portion is embedded in the first bonding structure, the third winding portion is embedded in the second bonding structure, the fourth winding portion is embedded in the second interconnection structure, and a material of the second winding portion differs from a material of the first winding portion.
A manufacturing method of a semiconductor package, comprising:
- providing a first die comprising:
- providing a first semiconductor substrate having a first interconnection structure formed thereon, wherein a first coil of an inductor is formed in the first interconnection structure;
- forming a second coil of the inductor and conductive pads over the first interconnection structure, the second coil being electrically connected to the first coil, wherein the conductive pads and the second coil are simultaneously formed;
- and
- forming a first inductor bonding via and a first inductor bonding pad over the first interconnection structure, wherein the first inductor bonding via and the first inductor bonding pad are electrically connected to the first coil and the second coil;
- providing a second die having a third coil of the inductor, a second bonding via, and a second inductor bonding pad, wherein the second bonding via and the second inductor bonding pad are connected to the third coil;
- and
- forming the inductor by bonding the first inductor bonding pad to the second inductor bonding pad.
Dependencies are inferred from the claim text.