Substrate structure and semiconductor package structure including the same

A substrate structure, comprising:

• a substrate body having a top surface and a bottom surface opposite to the top surface;
• a bottom circuit layer disposed adjacent to the bottom surface of the substrate body, and including a plurality of pads;
• a first bottom protection structure disposed on the bottom surface of the substrate body, and covering a portion of the bottom circuit layer;
• a second bottom protection structure disposed on the bottom surface of the substrate body, and covering a portion of the bottom circuit layer, wherein a second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure;
• and
• a top circuit layer disposed adjacent to the top surface of the substrate body, and electrically connected to the bottom circuit layer.

A semiconductor package structure, comprising:

• a substrate structure, comprising:
• a substrate body having a top surface and a bottom surface opposite to the top surface;
• a bottom circuit layer disposed adjacent to the bottom surface of the substrate body, and including a plurality of pads;
• a first bottom protection structure disposed on the bottom surface of the substrate body, and covering a portion of the bottom circuit layer, wherein the first bottom protection structure is disposed substantially under the die bonding area;
• and
• a second bottom protection structure disposed on the bottom surface of the substrate body, and covering a portion of the bottom circuit layer, wherein a second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure;
• a semiconductor die electrically connected to the top surface of the substrate structure;
• and
• an encapsulant covering the semiconductor die and the substrate structure.