Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a first substrate having a first surface and a second surface opposite to the first surface;
• a first electronic component disposed on the first surface of the first substrate;
• a second electronic component disposed on the second surface of the first substrate;
• a frame board disposed on the second surface of the first substrate;
• and
• a first package body disposed on a portion of the first surface of the first substrate and covering the first electronic component, wherein the first package body has a lateral surface recessed from a lateral surface of the first substrate.

A semiconductor device package, comprising:

• a first substrate having a first surface and a second surface opposite to the first surface;
• a first electronic component disposed on the first surface of the first substrate;
• a second electronic component disposed on the second surface of the first substrate;
• a frame board disposed on the second surface of the first substrate, wherein the frame board is electrically connected to the first substrate through an adhesive element, wherein a thickness of the second electronic component is greater than a thickness of the frame board;
• a first package body disposed on a portion of the first surface of the first substrate and covering the first electronic component.