Semiconductor device, semiconductor chip and method of dicing a semiconductor substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsHyun-Su Sim, Yoon-Sung Kim, Yun-Hee Kim, Byung-Moon Bae, Jun-Ho Yoon
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Abstract
A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.
Claims19
A semiconductor device, comprising:
- a semiconductor substrate having a scribe lane defined therein;
- a plurality of semiconductor chips formed on an upper surface of the semiconductor substrate;
- at least one conductive structure arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof;
- a test pad arranged on an upper surface of the scribe lane;
- and
- a fillet arranged on at least one side surface of the conductive structure, the fillet configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure,
- wherein the fillet is arranged on opposite side surfaces of the test pad, and
- wherein the fillet comprises an insulating material.
A semiconductor device, comprising:
- a semiconductor substrate having a scribe lane defined therein;
- a plurality of semiconductor chips formed on an upper surface of the semiconductor substrate;
- at least one conductive structure arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof;
- and
- a fillet arranged on at least one side surface of the conductive structure, the fillet configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure,
- wherein the conductive structure comprises a test element group (TEG) configured for testing the plurality of semiconductor chips.
A semiconductor chip, comprising:
- an internal circuit;
- at least one conductive structure arranged along side the internal circuit;
- and
- fillet arranged on at least one side surface of the conductive structure,
- wherein the fillet comprises an insulating material.
Dependencies are inferred from the claim text.