Segregated power and ground design for yield improvement

A package comprising:

• a package component;
• an encapsulant encapsulating the package component therein;
• a first plurality of dielectric layers over the package component and the encapsulant, wherein the first plurality of dielectric layers are formed of polymers;
• a first plurality of redistribution layers extending into the first plurality of dielectric layers, wherein the first plurality of redistribution layers comprise a plurality of power/ground pad stacks arranged as an array overlapping the package component, wherein the plurality of power/ground pad stacks comprise a plurality of power pad stacks and a plurality of ground pad stacks, with each of the plurality of power/ground pad stacks having a pad in each of the first plurality of redistribution layers;
• a second plurality of dielectric layers over the first plurality of redistribution layers, wherein the second plurality of dielectric layers are formed of molding compounds;
• and
• a second plurality of redistribution layers over the first plurality of redistribution layers.

A package comprising:

• a plurality of package components, wherein the plurality of package components comprise device dies;
• a molding compound encapsulating the plurality of package components therein;
• a first plurality of redistribution layers over and electrically connecting to the plurality of package components, wherein the first plurality of redistribution layers comprise a plurality of metal pad arrays, with each of the metal pad arrays overlapping a center region of one of the plurality of package components, and wherein each of the plurality of metal pad arrays comprises a plurality of power/ground pad stacks, and metal pads in the plurality of power ground pad stacks are staggered with each of an upper metal pad in each of the plurality of power/ground pad stacks comprising a first part overlapping a part of a corresponding lower metal pad in the each of the plurality of power/ground pad stacks, and a second part extending beyond edges of the corresponding lower metal pad;
• and
• a second plurality of redistribution layers over and electrically connecting to the first plurality of redistribution layers.