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US 11,107,763 B2Granted
Interconnect structure for stacked die in a microelectronic device
AssigneeIntel Corporation
InventorsThomas Wagner, Andreas Wolter, Georg Seidemann
Life of this patent
Estimating the term…
Abstract
A microelectronic package includes at least two semiconductor die, one die stacked over at least partially another. At a least the upper die is oriented with its active surface facing in the direction of a redistribution structure, and one or more wires are coupled to extend from contacts on that active surface into conductive structures in the redistribution structure.
Claims25
A microelectronic device, comprising:
- a first semiconductor die;
- a redistribution structure coupled to a first side of the semiconductor die, the redistribution structure including multiple conductive traces and vias formed therein;
- and
- a second semiconductor die extending at least partially above the first semiconductor die on the opposite side of the die from the redistribution structure, the second semiconductor die having an active surface facing the redistribution structure, and including one or more wires coupled to the active surface and extending away from the conductive surface and into respective conductive structures of the redistribution structure.
1 more element
A method of forming a microelectronic device package, comprising:
- attaching a first semiconductor die to a carrier through use of an adhesive material layer, with an active surface of the die contacting the adhesive material layer;
- attaching multiple wires to respective contact surfaces at an active surface of a second semiconductor die, the wires extending from the active surface of the second semiconductor die;
- placing the second semiconductor die in partially overlapping relation to the first semiconductor die, with the active surface of the second semiconductor die facing the carrier, and the multiple wires extending beyond the first semiconductor die and into the adhesive material layer;
- forming a molded component around the first and second semiconductor die;
- removing the adhesive material layer;
- and
- forming a redistribution structure supported by the first semiconductor die and the molded component, the redistribution structure having multiple conductive traces and vias formed therein, the redistribution structure formed with conductive structures surrounding the wires extending from the second semiconductor die.
4 more elements
An electronic system, comprising:
- a microelectronic device, comprising,
- a first semiconductor die;
- a redistribution structure coupled to a first side of the semiconductor die, the redistribution structure having multiple conductive traces and vias formed therein;
- and
- a second semiconductor die extending at least partially above the first semiconductor die on the opposite side of the die from the redistribution structure, the second semiconductor die having one or more wires coupled to an active surface of the second semiconductor die extending closest to the redistribution structure, the one or more wires extending beyond a proximal surface of the redistribution structure and into respective conductive structures in the redistribution structure;
- and
- at least one of another microelectronic device, a mass storage device and a network interface operably coupled to the microelectronic device.
4 more elements
Dependencies are inferred from the claim text.