Semiconductor device, electric power conversion apparatus and method for manufacturing semiconductor device

A semiconductor device comprising:

• an insulating substrate having an organic insulating layer and a circuit pattern provided on the organic insulating layer;
• and
• a semiconductor chip provided on an upper surface of the circuit pattern, wherein
• a thickness of the circuit pattern is not less than 1 mm and not more than 3 mm,
• the circuit pattern includes a first circuit pattern and a second circuit pattern thinner than the first circuit pattern, and
• the semiconductor chip includes a first semiconductor chip provided on an upper surface of the first circuit pattern, and a second semiconductor chip provided on an upper surface of the second circuit pattern, the second semiconductor chip being thicker than the first semiconductor chip.

An electric power conversion apparatus comprising:

• a main converter circuit that has the semiconductor device and converts and outputs input electric power, the semiconductor device including:
• an insulating substrate having an organic insulating layer and a circuit pattern provided on the organic insulating layer;
• and
• a semiconductor chip provided on an upper surface of the circuit pattern, wherein
• a thickness of the circuit pattern is not less than 1 mm and not more than 3 mm;
• a drive circuit that outputs a drive signal for driving the semiconductor device to the semiconductor device;
• and
• a control circuit that outputs a control signal for controlling the drive circuit to the drive circuit.