Integrated circuit structures in package substrates
AssigneeIntel Corporation
InventorsSanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
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Abstract
Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
Claims20
An integrated circuit (IC) package, comprising:
- a package substrate;
- and
- a die coupled to the package substrate;
- wherein the package substrate includes a shield structure, wherein the shield structure includes at least one via and at least one pad arranged to provide solid walls of conductive material proximate to edges of the package substrates such that the solid walls of conductive material together provide a continuous conductive material ring around an interior portion of the package substrate.
An antenna structure in an integrated circuit (IC) package substrate, comprising:
- a first metal layer including an antenna and a ground plane having a first opening portion into which the antenna extends;
- a feeding structure coupled to the antenna, wherein the feeding structure includes at least one via;
- and
- a second metal layer, wherein the second metal layer includes at least a portion of the feeding structure, and the feeding structure extends into a second opening portion in the second metal layer.
Dependencies are inferred from the claim text.