Semiconductor device and method for manufacturing the same, and power conversion device

A method for manufacturing a semiconductor device, the method comprising:

• joining a conductor substrate above an insulating substrate including an insulating layer to sandwich a semiconductor element therebetween;
• placing the insulating substrate, the semiconductor element, and the conductor substrate to be surrounded by a case member;
• and
• sealing the semiconductor element by supplying a sealant into a region surrounded by the case member,
• the case member surrounding the region overlapping with the insulating substrate, the semiconductor element, and the conductor substrate in plan view to avoid the region,
• forming a plurality of metal patterns spaced from each other on a main surface of the insulating layer,
• forming a groove between a pair of adjacent metal patterns of the plurality of metal patterns,
• forming a through hole in the conductor substrate at a position overlapping with the groove in plan view.