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US 11,107,754 B2Granted
Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe
AssigneeInfineon Technologies AG
InventorsJia Yi Wong, Kar Meng Ho
Life of this patent
Estimating the term…
Abstract
An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.
Claims17
An electronic device, comprising:
- a semiconductor chip, and
- a leadframe comprising a first class of leads and a second class of leads,
- wherein a thickness of leads of the second class of leads is smaller than a thickness of leads of the first class of leads in a direction perpendicular to a common plane of the first class of leads and the second class of leads, wherein an encapsulation body encapsulates the semiconductor die, wherein a pitch of the leads of the second class of leads exterior to the encapsulation body is smaller than a pitch of the leads of the first class of leads exterior to the encapsulation body, wherein the first class of leads and the second class of leads are arranged to be coplanar, wherein a pitch of the leads of the second class of leads is equal to or less than 80% of the thickness of the leads of the second class of leads.
A leadframe for an electronic device, comprising:
- a first leadframe part comprising a first class of leads, and
- a second leadframe part comprising a second class of leads,
- wherein a thickness of leads of the second class of leads is smaller than a thickness of leads of the first class of leads in a direction perpendicular to a common plane of the first class of leads and the second class of leads, wherein the leads of the first and second class of leads are arranged to be coplanar, wherein the leadframe further comprises a frame that includes an indentation, wherein the second leadframe part is fixed to the indentation within the frame, and wherein a pitch of the leads of the second class of leads is equal to or less than 80% of the thickness of the leads of the second class of leads.
An electronic device, comprising:
- a semiconductor chip, and
- a leadframe comprising a first class of leads and a second class of leads,
- wherein a thickness of leads of the second class of leads is smaller than a thickness of leads of the first class of leads in a direction perpendicular to a common plane of the first class of leads and the second class of leads, wherein an encapsulation body encapsulates the semiconductor die, wherein a pitch of the leads of the second class of leads exterior to the encapsulation body is smaller than a pitch of the leads of the first class of leads exterior to the encapsulation body, wherein the first class of leads and the second class of leads are arranged to be coplanar, and wherein the second class of leads comprises one or more of an I/O terminal, a gate terminal, a voltage sensing terminal and a temperature sensing terminal of the electronic device.
A leadframe for an electronic device, comprising:
- a first leadframe part comprising a first class of leads, and
- a second leadframe part comprising a second class of leads,
- wherein a thickness of leads of the second class of leads is smaller than a thickness of leads of the first class of leads in a direction perpendicular to a common plane of the first class of leads and the second class of leads, wherein the leads of the first and second class of leads are arranged to be coplanar, wherein the leadframe further comprises a frame that includes an indentation, wherein the second leadframe part is fixed to the indentation within the frame, and wherein the second class of leads comprises one or more of an I/O terminal, a gate terminal, a voltage sensing terminal and a temperature sensing terminal of the electronic device.
Dependencies are inferred from the claim text.