Chip on film package and display device including the same

A chip on a film package, comprising:

• a flexible base film having a first surface and a chip mounting region on the first surface;
• a semiconductor chip mounted in the chip mounting region;
• a heat dissipating insulation layer on the semiconductor chip, wherein the heat dissipating insulation layer covers at least one side surface of the semiconductor chip;
• a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip;
• and
• a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members;
• and
• wherein the second heat dissipation member contacts the first surface of the flexible base film to completely fill a space between the semiconductor chip and the pair of first heat dissipation members.

A display device, comprising:

• a display panel;
• and
• a chip on film package extending from the display panel and flexed to cover a lower surface of the display panel, wherein the chip on film package comprises:
• a flexible base film connected to the display panel, and having a first surface and a chip mounting region on the first surface:
• a semiconductor chip mounted in the chip mounting region;
• a heat dissipating insulation layer on the semiconductor chip;
• a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, wherein the semiconductor chip is disposed between the pair of first heat dissipation members;
• and
• a second heat dissipation member on the first surface of the base film to cover the semiconductor chip and the pair of first heat dissipation members,
• wherein each first heat dissipation member of the pair of first heat dissipation members covers a side surface of the semiconductor chip;
• and
• wherein the second heat dissipation member contacts the first surface of the flexible base film to completely fill a space between the semiconductor chip and the pair of first heat dissipation members.