Automation line for processing a molded panel
AssigneePyxis Cf Pte. Ltd.
InventorAmlan Sen
Life of this patent
Estimating the term…
Abstract
An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.
Claims19
An automation line for processing a molded panel, the automation line comprising:
- (A) a release workstation capable of receiving an intermediate panel assembly, which comprises the molded panel attached to a first carrier, wherein the intermediate panel assembly is in an orientation with the first carrier on a topside, the release workstation comprising
- (1) a release unit including
- (a) a carrier-engagement arrangement movable to engage the first carrier, the carrier-engagement arrangement comprising
- (i) a heating sub-arrangement to thermally contact the first carrier, and
- (ii) an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement,
- wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of a thermal release adhesive and to separate the first carrier from the molded panel;
- (B) a transfer workstation capable of receiving the separated molded panel from the release workstation, the transfer workstation comprising
- (1) a transfer unit including
- (a) a molded-panel-engagement arrangement movable to engage the separated molded panel, the molded-panel-engagement arrangement comprising
- (i) a step-down-heating sub-arrangement to thermally contact the separated molded panel, and
- (ii) an attachment sub-arrangement to attach the separated molded panel to the molded-panel-engagement arrangement,
- wherein the molded-panel-engagement arrangement is operable to regulate a temperature of the step-down-heating sub-arrangement between an ambient temperature and the release temperature, and
- (b) a transporter unit including
- (i) a transporter tray movable into and out of the transfer unit in a manner so as to carry and position a second carrier underneath the separated molded panel held by the molded-panel-engagement arrangement for placing the separated molded panel on the second carrier;
- and
- (C) a conveying arrangement comprising
- (1) at least one conveying element movable to carry the separated molded panel from the release workstation to the transfer workstation.
Dependencies are inferred from the claim text.