Techniques for thermal treatment of electronic devices

A method of manufacturing an electronic device, the method comprising:

• depositing an organic material in a pattern on a substrate while the substrate is positioned in a first processing environment of a printing system, the first processing environment having a first oxygen content;
• after the depositing of the organic material, transferring the substrate with the organic material deposited thereon to a second processing environment of a thermal treatment module, the second processing environment having a second oxygen content;
• loading the substrate into one thermally-controlled region of a plurality of thermally-controlled regions disposed in a stacked configuration in the thermal treatment module;
• thermally treating the organic material deposited on the substrate while the substrate is located in the second processing environment and is in the one thermally-controlled region;
• controlling a temperature of the one thermally-controlled region during the thermally treating the organic material;
• and
• controlling the first processing environment during depositing the organic material on the substrate and the second processing environment during thermally treating the organic material such that the first oxygen content of the first processing environment is at least 100 times greater than the second oxygen content of the second processing environment.