Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
AssigneeApplied Materials, Inc.
InventorPaul Z. Wirth
Life of this patent
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Abstract
A temperature-controllable process chamber configured to process substrates may include one or more vertical walls at least partially defining a chamber portion of the process chamber. Multiple zones may be located about a periphery of the one or more vertical walls and multiple temperature control devices are thermally coupled to the periphery of the one or more vertical walls in each of the multiple zones. A controller coupled to the temperature control devices may be configured to individually control temperatures of the multiple temperature control devices to obtain substantial temperature uniformity across a substrate located in the chamber portion. Other systems and methods of manufacturing substrates are disclosed.
Claims19
A process chamber for processing substrates, comprising:
- one or more vertical walls at least partially defining a chamber portion of the process chamber;
- multiple zones located about a periphery of the one or more vertical walls;
- one or more grooves located in the periphery of the one or more vertical walls, the one or more grooves defining one or more boundaries between at least a first zone and a second zone;
- temperature control devices, each thermally coupled to the one or more vertical walls in one of the multiple zones;
- and
- a controller coupled to the temperature control devices and configured to set temperatures of one or more of the temperature control devices to obtain temperature uniformity within 2% across a substrate located in the chamber portion.
A process chamber for processing substrates, comprising:
- one or more vertical walls at least partially defining a chamber portion of the process chamber;
- multiple zones located about a periphery of the one or more vertical walls;
- a first cover covering a first end of the chamber portion, the first cover including one or more first cover zones;
- temperature control devices, each thermally coupled to the one or more vertical walls in one of the multiple zones;
- additional temperature control devices, each coupled to an outer periphery of the first cover in one of the one or more first cover zones;
- and
- a controller coupled to each of the temperature control devices and configured to set temperatures of the temperature control devices to obtain temperature uniformity of better than 2% across a substrate located in the chamber portion.
An electronic device processing system, comprising:
- a transfer chamber;
- one or more process chambers coupled to the transfer chamber and configured to receive a substrate, at least one of the one or more process chambers comprising:
- one or more walls, wherein the one or more walls comprise a first zone and a second zone, wherein a first temperature control device is coupled to a wall in the first zone and a second temperature control device is coupled to a wall in the second zone;
- one or more grooves located in at least one of the one or more walls, the one or more grooves defining one or more boundaries between the first zone and the second zone;
- and
- multiple temperature control devices coupled to the one or more walls;
- and
- a controller coupled to the multiple temperature control devices and configured to set temperatures of the multiple temperature control devices to obtain temperature uniformity across the substrate within a predetermined value.
Dependencies are inferred from the claim text.