Heating platform, thermal treatment and manufacturing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsiao-Hua Peng, Hann-Ru Chen
Life of this patent
Estimating the term…
Abstract
A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.
Claims19
A heating platform for heating a wafer, the heating platform comprising:
- a support carrier, the wafer being supported by the support carrier;
- a detection module, configured to monitor a surface condition of the wafer supported by the support carrier, wherein the surface condition comprises topography of a top surface of the wafer;
- and
- a first heating module disposed at a side of the support carrier, the first heating module comprising a plurality of heating units electrically connected to the detection module, and the heating units being arranged in an array, wherein the first heating module further comprises a hole configured for an inlet of a process equipment to pass through, and the plurality of heating units surrounds the hole.
A thermal treatment, comprising:
- providing a wafer onto a heating platform;
- detecting a surface condition of the wafer by a detection module of the heating platform, wherein the surface condition comprises topography of a top surface of the wafer;
- and
- performing a wafer heating process by a heating module of the heating platform according to information detected by the detection module, wherein the heating module comprises a plurality of heating units, and the heating units are arranged in array, wherein two adjacent rows of the array of the heating units are substantially aligned along a column direction.
A manufacturing method, comprising:
- performing a first process on a wafer, wherein the first process comprises a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a dry etching process, a wet etching process or a chemical-mechanical polishing (CMP) process;
- obtaining information of a surface condition of the wafer after performing the first process, wherein the surface condition comprises topography of a top surface of the wafer;
- and
- performing a second process on the wafer, wherein a wafer heating process is performed on the wafer by a heating module according to the information of the surface condition during the second process, the heating module comprises a plurality of heating units, and the heating units are arranged in array.
Dependencies are inferred from the claim text.