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US 11,107,700 B2Granted
Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure
AssigneeSamsung Electronics Co., Ltd.
InventorKyoung Lim Suk
Life of this patent
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Abstract
A method of fabricating a semiconductor package may include forming a lower re-distribution layer, forming a stack, bonding the stack to a portion of the lower re-distribution layer, stacking a semiconductor chip on a top surface of the lower re-distribution layer, and forming an upper re-distribution layer on the semiconductor chip and the stack.
Claims19
A method of fabricating a semiconductor package, comprising:
- forming a lower re-distribution layer on a first substrate;
- forming a stack on a top surface of a second substrate different from the first substrate;
- removing the stack from the top surface of the second substrate;
- bonding the stack to a portion of the lower re-distribution layer;
- after bonding the stack, stacking a semiconductor chip on a top surface of the lower re-distribution layer;
- and
- forming an upper re-distribution layer on the semiconductor chip and the stack.
4 more elements
A method of fabricating a re-distribution structure, comprising:
- forming a lower re-distribution layer on a first substrate;
- forming a stack on a top surface of a second substrate different from the first substrate;
- removing the stack from the top surface of the second substrate;
- and
- bonding the stack to a top surface of the lower re-distribution layer,
- wherein the stack comprises:
- a first insulating layer disposed on the top surface of the lower re-distribution layer;
- a second insulating layer disposed on a top surface of the first insulating layer;
- a first via penetrating the first insulating layer;
- and
- a second via penetrating the second insulating layer.
8 more elements
A method of manufacturing a semiconductor package, the method comprising:
- forming a lower re-distribution layer on a first substrate;
- forming a stack of insulators and conductor patterns on a second substrate different from the first substrate;
- removing the stack from the second substrate;
- bonding the stack to a portion of the lower re-distribution layer;
- after bonding the stack, disposing a semiconductor chip on a top surface of the lower re-distribution layer;
- and
- forming an upper re-distribution layer on the semiconductor chip and the stack.
4 more elements
Dependencies are inferred from the claim text.