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AssigneeSCREEN Holdings Co., Ltd.
InventorsChisayo Nakayama, Yuji Tanaka, Masahiko Harumoto, Masaya Asai, Yasuhiro Fukumoto, Tomohiro Matsuo, Takeharu Ishii
Estimating the term…
An oxygen concentration is lowered in accordance with a set lowering process, and thereafter a heat treatment is performed. Accordingly, the heat treatment is performed to a substrate W while the oxygen concentration in a heat treating space HS is lowered. Consequently, a treatment atmosphere within the heat treating space is able to be made suitable for a heat treatment process, leading to appropriate film deposition. In addition, the oxygen concentration is lowered in accordance with a concentration level in recipes. This avoids an excessively lowered oxygen concentration, leading to prevention of reduced throughput.
A substrate treating method for performing a heat treatment to a substrate having a treated film formed thereon within a heat treating space of a heat treating chamber, the method comprising:
Dependencies are inferred from the claim text.