Method for releasing sample and plasma processing apparatus using same
AssigneeHitachi High-Tech Corporation
InventorsMasaki Ishiguro, Masahiro Sumiya, Shigeru Shirayone, Tomoyuki Tamura, Kazuyuki Ikenaga
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Abstract
A sample releasing method for releasing a sample subjected to plasma processing from a sample stage on which the sample is electrostatically attracted by applying DC voltage to an electrostatic chuck electrode, and the method includes: moving the sample subjected to the plasma processing upward above the sample stage; and after moving the sample, controlling the DC voltage such that an electric potential of the sample is to be smaller.
Claims1
A sample releasing method for releasing a sample subjected to plasma processing in a processing chamber from a sample stage on which the sample is electrostatically attracted by applying a DC voltage by a DC power source to an electrode, the method comprising the steps of:
- moving a pin to an upward position thereby lifting the sample above the sample stage while radio frequency power is provided;
- interrupting the radio frequency power after moving the pin to an upward position;
- while the pin is in the upward position, controlling an output value of the DC power source to apply, after a predetermined time from the interruption of the radio frequency power, a first predetermined voltage to the electrode by changeover from a second predetermined voltage, such that an absolute value of the second predetermined voltage is lower than an absolute value of the first predetermined voltage;
- controlling a conveyance mechanism to convey the sample outside the processing chamber while controlling the output value of the DC power source to apply the first predetermined voltage to the electrode;
- after the sample is conveyed outside the chamber by the conveyance mechanism, controlling the output value of the DC power source to apply the second predetermined voltage.
Dependencies are inferred from the claim text.