Semiconductor manufacturing method and semiconductor manufacturing device

A semiconductor manufacturing device, comprising:

• a first substrate support base configured to support a diamond substrate;
• a second substrate support base, which is provided so as to be opposed to the first substrate support base, and which is configured to support a semiconductor substrate;
• a support base driver configured to move one or both of the first substrate support base and the second substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction of the semiconductor substrate;
• a second mechanism configured to deform a surface of the second substrate support base opposed to the first substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate;
• and
• the semiconductor manufacturing device comprising a first mechanism configured to deform to a non-planar shape the surface of the first substrate support base facing towards the second substrate support base in conformity with a surface of the diamond substrate facing towards the first substrate support base,
• wherein the first mechanism is configured to deform to the non-planar shape the surface of the first substrate support base facing towards the second substrate support base in conformity with the surface of the diamond substrate facing forwards the first substrate support base without deforming the diamond substrate,
• wherein the support base driver is configured to bring the diamond substrate and the semiconductor substrate into close contact with each other under the state in which the pressure is applied to the diamond substrate and the semiconductor substrate in the thickness direction of the semiconductor substrate without deforming the diamond substrate.

A semiconductor manufacturing device, comprising:

• a first substrate support base configured to support a diamond substrate;
• a second substrate support base, which is provided so as to be opposed to the first substrate support base, and which is configured to support a semiconductor substrate;
• a support base driver configured to move one or both of the first substrate support base and the second substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction of the semiconductor substrate;
• and
• a first substrate fixing jig, which is provided between the diamond substrate and the first substrate support base, and has a surface opposed to the diamond substrate being a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the first substrate support base,
• wherein the second substrate support base is configured to support the semiconductor substrate so that a surface of the semiconductor substrate opposed to the diamond substrate is deformable, and
• wherein, when the pressure is applied to the diamond substrate and the semiconductor substrate in the thickness direction, the surface of the semiconductor substrate opposed to the diamond substrate is formed into a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate through use of the pressure,
• wherein the support base driver is configured to bring the diamond substrate and the semiconductor substrate into close contact with each other under the state in which the pressure is applied to the diamond substrate and the semiconductor substrate in the thickness direction of the semiconductor substrate without deforming the diamond substrate.