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US 11,107,678 B2Granted
Wafer process, apparatus and method of manufacturing an article
AssigneeCanon Kabushiki Kaisha
InventorByung-Jin Choi
Life of this patent
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Abstract
An apparatus is provided. The apparatus has a chuck having a first side configured to retain a superstrate or a template and a second side, an array of image sensors disposed at the second side of the chuck and spaced from the chuck, and an array of light sources disposed between the transparent chuck and the array of image sensors.
Claims12
An apparatus, comprising:
- a chuck having a first side configured to retain a superstrate or a template and a second side;
- an array of image sensors disposed at the second side of the chuck and spaced from the chuck;
- and
- an array of light sources disposed between the chuck transparent to the light sources and the array of image sensors.
1 more element
Dependencies are inferred from the claim text.