Method of processing semiconductor substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu
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Abstract
A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.
Claims20
A method, comprising:
- disposing a semiconductor substrate over a chuck, wherein the chuck has a plurality of holes therein, and the semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto;
- providing a spray to the first surface of the semiconductor substrate through the holes of the chuck;
- after providing the spray to the first surface of the semiconductor substrate, forming a liquid layer flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck;
- and
- moving the semiconductor substrate toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.
A method, comprising:
- disposing a semiconductor substrate over and spaced apart from a chuck;
- after disposing the semiconductor substrate, supplying a liquid over a principal surface of the chuck;
- moving the semiconductor substrate down to the liquid after supplying the liquid over the principal surface of the chuck;
- and
- vertically moving the semiconductor substrate when the semiconductor substrate is in contact with the liquid.
A method, comprising:
- disposing a semiconductor substrate over a chuck, wherein the chuck has a plurality of holes therein, and the semiconductor substrate has opposite first and second surfaces;
- wetting the first surface of the semiconductor substrate facing toward the chuck by using a spray;
- after wetting the first surface of the semiconductor substrate by using the spray, supplying a liquid over the chuck through the holes of the chuck, wherein the liquid exiting each of the holes of the chuck has a first velocity component substantially parallel to the first surface of the semiconductor substrate, and a second velocity component substantially perpendicular to the first surface of the semiconductor substrate;
- and
- allowing the first surface of the semiconductor substrate to be in contact with the liquid.
Dependencies are inferred from the claim text.