Functionality change based on stress-engineered components

A method of changing functionality of a device configured to implement a plurality of functions and comprising a stress-engineered portion and at least one second portion, the method comprising:

• fracturing the stress-engineered portion of the device via a trigger mechanism attached to, and supported by, the stress-engineered portion while leaving the at least one second portion intact, the stress-engineered portion comprising:
• at least one tensile stress layer having a residual tensile stress;
• and
• at least one compressive stress layer having a residual compressive stress and being mechanically coupled to the at least one tensile stress layer such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating, the stress-engineered portion fracturing due to propagating cracks generated in response to energy applied to the stress-engineered portion via the trigger mechanism;
• and
• in response to the fracturing of the stress-engineered portion, while leaving the at least one second portion intact and the device operable, causing a functionality of the device to change from a first function to a second function, different from the first function;
• wherein each of the first and second functions comprises at least one of an electrical function, a mechanical function, and an optical function.