Multilayer capacitor and board having the same mounted thereon

A board having a multilayer capacitor mounted thereon, the board comprising:

• a substrate including first and second electrode pads on one surface of the substrate;
• and
• a capacitor body having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and opposing each other, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively;
• and first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions extending from the first and second connection portions to portions of the fifth and sixth surfaces of the capacitor body, respectively,
• wherein a first distance, along one of the fifth and sixth surfaces, between the first and second external electrodes, is less than a second distance, along one of the first and second surfaces, between the first and second external electrodes,
• the capacitor body is disposed on the first and second electrode pads,
• the board further comprises a first solder connecting the first connection portion and the first electrode pad to each other, and a second solder connecting the second connection portion and the second electrode pad to each other,
• the first and second external electrodes further comprise third and fourth band portions extending from the first and second connection portions to portions of the first surface of the capacitor body, respectively, and
• a ratio of a length of the third band portion to a length of the first band portion, and a ratio of a length of the fourth band portion to a length of the second band portion, are each greater than 0.13 and less than 0.67.