Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• an element body including:
• internal electrode layers and dielectric layers alternately laminated in a lamination direction, the dielectric layers having a main component of a dielectric material;
• an upper surface;
• a lower surface located on a side of the element body opposite the upper surface, in the lamination direction, the lower surface being entirely exposed to an outside;
• and
• a reinforcement layer included in the upper surface or the lower surface, made of a material whose elasticity or linear thermal expansion coefficient is lower than that of the dielectric layers, and comprised of a glass component including 30 to 70 mass % of SiO2, an outer surface of the reinforcement layer defining the upper surface or the lower surface, an inner surface of the reinforcement layer defining a boundary to one of the dielectric layers;
• and
• a terminal electrode disposed on an outer surface of the element body to be contacted and connected with the internal electrode layers, the terminal electrode including:
• an end-side electrode part covering a leading end of the element body where the internal electrode layers are led;
• and
• an upper-side electrode part disposed on a part of the upper surface of the element body and continuing to the end-side electrode part,
• wherein a thickness of the multilayer ceramic electronic component is less than 100 μm.

A multilayer ceramic electronic component comprising:

• an element body including:
• internal electrode layers and dielectric layers alternately laminated in a lamination direction, the dielectric layers having a main component of a dielectric material;
• an upper surface;
• a lower surface located on a side of the element body opposite the upper surface, in the lamination direction;
• and
• a reinforcement layer included in the upper surface or the lower surface, made of a material whose elasticity or linear thermal expansion coefficient is lower than that of the dielectric layers, and comprised of a glass component including 30 to 70 mass % of SiO2, an outer surface of the reinforcement layer defining the upper surface or the lower surface, an inner surface of the reinforcement layer defining a boundary to one of the dielectric layers;
• and
• a terminal electrode disposed on an outer surface of the element body to be contacted and connected with the internal electrode layers, the terminal electrode being not substantially disposed on the upper surface of the element body or the lower surface of the element body, the terminal electrode including:
• an end-side electrode part covering a leading end of the element body where the internal electrode layers are led,
• wherein a thickness of the multilayer ceramic electronic component is less than 100 μm.