Ceramic electronic device and manufacturing method of ceramic electronic device

A ceramic electronic device comprising:

• a ceramic main body that has at least two edge faces facing each other, has an internal electrode layer inside thereof and has a parallelepiped shape;
• and
• external electrodes formed on the two edge faces,
• wherein:
• the external electrodes have a structure in which a plated layer is formed on a ground layer having ceramic;
• a main component of the ground layer is a metal;
• the external electrodes have an extension region that extends to at least one of four side faces from the two edge faces of the ceramic main body;
• a part of the extension region corresponding to a corner portion of the ceramic main body includes a portion where the ground layer is formed, and a first portion where the ground layer is not formed;
• the plated layer covers not only the ground layer but also the first portion;
• and
• the plated layer has an average thickness that is 30% or more with respect to a maximum distance of the first portion along a surface of the ceramic main body.

A manufacturing method of a ceramic electronic device comprising:

• preparing a ceramic main body that has at least two edge faces facing each other, has an internal electrode layer inside thereof, has a parallelepiped shape and has a ground layer, a main component of the ground layer being a metal, the ground layer having an extension region extending from the two edge faces toward at least one of four side faces of the ceramic main body, a part of the extension region corresponding to a corner portion of the ceramic main body including a portion where the ground layer is formed, and a first portion where the ground layer is not formed;
• and
• forming a plated layer on the ground layer and the first portion by a plating process;
• wherein the average thickness of the plated layer is 50% or more and 100% or less with respect to a maximum distance of the first portion along a surface of the ceramic main body.