Detecting targeted locations in a semiconductor specimen
AssigneeApplied Materials Israel Ltd.
InventorsElad Cohen, Yuri Feigin, Lior Katz, Eyal Neistein
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AssigneeApplied Materials Israel Ltd.
InventorsElad Cohen, Yuri Feigin, Lior Katz, Eyal Neistein
Estimating the term…
A method and system for detecting defects in a specimen, the method comprising: obtaining an image comprising a plurality of pixels of a specimen part; processing the image according to a detection recipe to derive information related to potential defects in the specimen, the information comprising a first data set informative of first locations identified, in accordance with the detection recipe as locations of potential defects, and a second data set informative of second locations not identified as locations of potential defects; receiving data specifying targeted locations of interest within the part of the specimen; when the first data set is not informative of each targeted location, generating a third data set by adding to the first data set information related to the missing targeted location from the second data set, the information bearing an indication that it corresponds to a targeted location; and outputting the third data set.
An examination system to detect defects in a specimen, the system comprising a processing and memory circuitry (PMC) to:
An examination system to detect defects in a specimen, the system comprising a processing and memory circuitry (PMC) for:
A method of specimen examination, comprising:
Dependencies are inferred from the claim text.