Mini smart card and method of manufacturing the same
AssigneeBeauiiful Card Corporation
InventorMeng-Jen Cheng
Life of this patent
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Abstract
A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.
Claims7
A mini smart card, comprising:
- a circuit layer having a top side and a bottom side and being 0.5 mm thick;
- two bilayered print layers disposed on the top side and the bottom side of the circuit layer, respectively, and being 0.1 mm thick each;
- and
- two transparent protective layers disposed on the bilayered print layers, respectively, and being 0.07 mm thick each;
- wherein the transparent protective layers are disposed on the bilayered print layers, respectively, after a surface layer has been removed from each said bilayered print layer.
Dependencies are inferred from the claim text.