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US 11,106,617 B2Granted
Memory module and data processing system for reducing heat generation
AssigneeSK hynix Inc.
InventorsMyoung Seo Kim, Seung Yong Lee, Young Pyo Joo
Life of this patent
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Abstract
A memory module may include: a plurality of stacked memory chips; a memory controller; and an interposer connected between the plurality of memory chips and the memory controller.
Claims18
A data processing system comprising:
- a substrate;
- and
- a plurality of sub systems connected to the substrate,
- wherein each of the sub systems comprises:
- an interposer vertically connected to the substrate;
- and
- a plurality of memory chips stacked vertically at the interposer in a direction parallel to the substrate.
4 more elements
A data processing system comprising:
- a substrate;
- and
- a plurality of sub systems connected to the substrate,
- wherein each of the sub systems comprises:
- an interposer vertically connected to the substrate;
- a memory controller connected to one side of the interposer;
- and
- a plurality of memory chips vertically stacked at the other side of the interposer in a direction parallel to the substrate.
5 more elements
A data processing system comprising:
- a substrate;
- and
- a plurality of sub systems coupled to the substrate,
- wherein each of the plurality of sub systems includes:
- an interposer connected to the substrate;
- a memory controller connected to one side of the interposer;
- and
- a plurality of memory chips stacked at the other side of the interposer,
- wherein the plurality of sub systems comprises:
- a first sub system group connected to the substrate through an interposer having a first length;
- and
- a second sub system group connected to the substrate through an interposer having a second length.
9 more elements
Dependencies are inferred from the claim text.