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US 11,105,753 B2Granted
Wafer shape and flatness measurement apparatus and method
AssigneeNanjing LiAn Semiconductor Limited
InventorAn Andrew Zeng
Life of this patent
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Abstract
A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.
Claims20
A wafer shape and flatness measurement apparatus comprising:
- a large aperture interferometer, and
- a reflective air bearing chuck comprising alternating vacuum nozzles and pressure nozzles arranged in a plurality of concentric rings and a distance between adjacent vacuum nozzle and pressure nozzle is substantially uniform for the vacuum nozzles and pressure nozzles on each concentric nozzle ring.
Dependencies are inferred from the claim text.