Sensor wiring substrate, sensor package, and sensor device

A sensor wiring substrate comprising:

• a plate-like substrate comprising a plurality of dielectric layers that are laminated, and
• a first accommodation recessed portion for accommodating an acoustic element and a second accommodation recessed portion for accommodating an infrared light emitting element that are disposed on a first surface;
• connection wiring comprising
• a first connection terminal disposed in the first accommodation recessed portion for electrically connecting to the acoustic element,
• a second connection terminal disposed in the second accommodation recessed portion for electrically connecting to the infrared light emitting element,
• external connection terminals for electrically connecting to an external circuit, and
• internal wiring electrically connecting the first connection terminal and the second connection terminal to the external connection terminals, respectively;
• and
• a low heat conduction portion having thermal conductivity lower than that of each of the plurality of dielectric layers, and disposed between the first accommodation recessed portion and the second accommodation recessed portion of the substrate,
• wherein the low heat conduction portion is further disposed between the second accommodation recessed portion and a side surface of the substrate.