Method for bonding large modules, and bonding arrangement
AssigneeHesse GmbH
InventorFrank Walther
Life of this patent
Estimating the term…
Abstract
A method for bonding large modules with the following steps, a large module is fed to a bonder from behind in a loading plane by means of a feeder unit. The large module is passed from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder. The large module is brought from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and is passed there to a vertical conveyor unit.
Claims14
A method for bonding modules, the method comprising:
- feeding a module to a bonder from behind in a loading plane via a feeder unit;
- passing the module from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder;
- positioning the module from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and passing the module to a vertical conveyor unit;
- moving the vertical conveyor unit, the module is moved vertically and brought into a bonding plane, wherein the module in the bonding plane is located at least partially in a working area of the bonder;
- processing the module by a first bonding head and/or by a second bonding head, wherein electrically conductive bond connections are produced on the module;
- moving the module vertically by the vertical conveyor unit out of the bonding plane into a second transfer position, and in the second transfer position is passed to a second transverse conveyor unit, wherein the second transfer position is provided in an unloading plane of the bonder;
- positioning the module by the second transverse conveyor unit into a second buffer position in the unloading plane;
- and passing, from the second buffer position, the module to a removal unit via the second transverse conveyor unit.
A bonding arrangement comprising:
- a bonder;
- a feeder unit for a module that is adapted to be processed by the bonder;
- and a removal unit for the module, wherein the bonder includes at least one bonding head via which electrically conductive bond connections are be produced on the module during the processing of the module, wherein the bonder includes a vertical conveyor unit that is designed to convey the module vertically out of a loading plane into a bonding plane and/or into an unloading plane, wherein the bonder includes a first transverse conveyor unit that is associated with the loading plane and is designed to receive the module from the feeder unit, to bring the module into a first buffer position provided in the loading plane, and to bring the module into a first transfer position in which the module is made available for transfer to the vertical conveyor unit, and wherein the bonder includes a second transverse conveyor unit that is associated with the unloading plane and is designed to receive the module from the vertical conveyor unit in a second transfer position, to bring the module into a second buffer position, wherein the second transfer position and the second buffer position are provided in the unloading plane, and to pass the module to the removal unit that is associated with the unloading plane.
Dependencies are inferred from the claim text.