Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board

A resin composition comprising:

• a cyanate compound (A);
• a maleimide compound (B);
• an epoxy resin (C);
• primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10;
• and
• a second boron nitride other than the primary hexagonal boron nitride particles (D), and
• optionally comprising an inorganic filler other than the primary hexagonal boron nitride particles (D) and the second boron nitride,
• wherein the cyanate compound (A) comprises a naphthol aralkyl-based cyanate compound represented by the following formula (A-1),
• wherein R1 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 to 50,
• the maleimide compound (B) comprises bis(3-ethyl-5-methyl-4-maleimidophenyl)methane and a maleimide compound represented by the following formula (B-1),
• wherein R5 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 or more,
• the epoxy resin (C) comprises a polyoxynaphthylene-based epoxy resin and a trisphenol-based epoxy resin,
• a content of the cyanate compound (A) is 10 to 80 parts by mass based on 100 parts by mass of the resin solid component,
• a content of the maleimide compound (B) is 10 to 80 parts by mass based on 100 parts by mass of the resin solid component,
• a content of the epoxy resin (C) is 3 to 80 parts by mass based on 100 parts by mass of the resin solid component, and
• a content of the primary hexagonal boron nitride particles (D) is 50 parts by mass or more based on 100 parts by mass of the resin solid component, provided that a total amount of the primary hexagonal boron nitride particles (D), the second boron nitride, and the inorganic filler is 301 parts by mass or less based on 100 parts by mass of the resin solid component.