Method for manufacturing a display motherboard

A method for manufacturing a display motherboard comprising the following steps, wherein the display motherboard comprises a plurality of display substrate areas each comprising a sub display area and a sub bending area:

• forming a back film material having a first adhesive force on a flexible underlying substrate;
• removing the back film material in positions above the sub bending areas of the plurality of display substrates;
• and
• treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force,
• wherein the back film material comprises an adhesive force variable adhesive material;
• the adhesive force variable adhesive material comprises an adhesive and an initiator;
• and
• the adhesive comprises any one or more of epoxy resin and polyurethane resin and the initiator comprises any one or more of azobisisobutyronitrile, fluorescein, and eosin,
• wherein the method further comprises:
• between the step of removing the back film material in positions above the sub bending areas of the plurality of display substrates and the step of treating the remaining back film material to form a back film having a second adhesive force,
• forming a protective film on one side of the back film material away from the flexible underlying substrate, the protective film covering openings of the back film material corresponding to the sub bending areas of the plurality of display substrates.