Component mounting apparatus

A component mounting apparatus having a nozzle attached to a head movable in an XY-plane using an XY-robot and configured to perform a component mounting operation in which the nozzle sucks a component supplied from a component supply device, carries the component to a predetermined position on a substrate and mounts the component in the predetermined position, the component mounting apparatus comprising:

• a control unit configured to
• control the XY-robot to perform repeatedly the component mounting operation while performing a thermal correction during a temperature rising period that begins with a temperature of the component mounting apparatus substantially at ambient temperature and ends when an amount of positional deviation due to heat from the XY-robot reaches a steady state,
• after the positional deviation amount has reached the steady state, control the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the positional deviation amount reaches the steady state, and
• control the XY-robot to perform a dummy operation to maintain the steady state during a standby period when the component mounting operation is not performed after the positional deviation amount has reached the steady state.