EMC cooling device

A cooling apparatus comprising a metallic and/or electrically conductive EMC enclosure and a converter (E1) and also a plurality of electrically operated units (E2, . . . , En) within the EMC enclosure, which is designed to influence a local temperature in at least one region inside or outside the EMC enclosure, wherein the converter (E1) directly supplies one or more of the plurality of electrically operated units (E2, . . . , En) with a respective supply voltage, and wherein the converter (E1) and the plurality of electrically operated units (E2, . . . , En) are each designed such that the line-bound and/or field-bound interference (Sxy) which is specifically generated by at least one of the plurality of electrically operated units during operation of the cooling apparatus is compensated for by a line-bound and/or field-bound interference (Sxy) of at least one of the respective other plurality of electrically operated units (E1, . . . , En) partially or completely in terms of its respective interference level (Pn), characterized in that the cooling apparatus is designed so that the at least one of the plurality of electrically operated units (E2, . . . , En) is mounted reversibly interchangeably with another of the plurality of electrically operated units (E2, . . . , En) in the cooling apparatus and the respective at least one of the plurality of electrically operated units (E2, . . . , En) is supplied directly with a supply voltage from a DC intermediate circuit (GZ) of the converter (E1).