Electronic module
AssigneeBrother Kogyo Ka Bush Iki Kaisha
InventorsTaiki Hashizume, Makoto Souda
Life of this patent
Estimating the term…
Abstract
An electronic module includes a circuit board having a mounting surface; a heat generating component mounted on the mounting surface; a frame supporting the circuit board; a cover covering the heat generating component and the mounting surface; and a heatsink mounted on the mounting surface. The heatsink includes at least one wall including a particular wall to which the heat generating component is attached. The heatsink further includes a shade portion provided at the at least one wall. The shade portion is located between the cover and the heat generating component in a direction perpendicular to the mounting surface.
Claims16
An electronic module, comprising:
- a circuit board having a mounting surface, the circuit board having a first side and a second side perpendicular to the first side;
- a heat generating component mounted on the mounting surface of the circuit board;
- a frame including non-flame-retardant resin, the frame extending in a direction perpendicular to the mounting surface and supporting the first side of the circuit board, the frame having a frame surface;
- a cover including metal, the cover extending in a direction parallel to the second side of the circuit board and covering the heat generating component and the mounting surface;
- and
- a heatsink mounted on the mounting surface of the circuit board adjacent to the first side, the heatsink including at least one wall including a particular wall to which the heat generating component is attached,
- wherein the heatsink further includes:
- a shade portion provided at the at least one wall, the shade portion located between the cover and the heat generating component in a direction perpendicular to the mounting surface.
A power supply circuit board module, comprising:
- a circuit board having a mounting surface;
- a first frame including flame-retardant resin;
- a second frame made of non-flame-retardant resin;
- a rectifier diode mounted on the mounting surface of the circuit board, wherein a distance between the rectifier diode and the second frame is less than a distance between the rectifier diode and the first frame;
- an upper cover extending between the first frame and the second frame and connected to the first frame and the second frame;
- and
- a heatsink mounted on the mounting surface of the circuit board, the heatsink including a particular wall extending in a direction perpendicular to the mounting surface toward the upper cover, the rectifier diode being attached to the particular wall,
- wherein the heatsink further includes:
- a shade portion extending from the particular wall such that the shade portion is located between the upper cover and the rectifier diode in the direction perpendicular to the mounting surface.
Dependencies are inferred from the claim text.