Outdoor electronics enclosure with modular structure

An assembly, comprising first and second modular electronics enclosures, each of the first and second modular electronics enclosures comprising:

• a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall, first and second opposed side walls that define an internal cavity, a door, and a cooling unit;
• wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;
• wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends Perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;
• wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;
• wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame;
• wherein the door hingedly attaches to one of the first or second wall panels of the first or second L-shaped pieces;
• wherein the cooling unit is mounted to the door for cooling the internal cavity;
• and
• wherein the second modular electronics enclosure is vertically stacked on and above the first electronics enclosure.

A modular electronics enclosure, comprising:

• a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity;
• wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;
• wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;
• and
• wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;
• and
• wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame with fasteners, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame with fasteners, and wherein the fasteners are located in the internal cavity of the shell such that the shell has no externally exposed fasteners.