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US 11,083,089 B1Granted
Integrated device package
AssigneeAnalog Devices International Unlimited Company
InventorsTeik Tiong Toong, Sok Mun Chew, Chern Beng Kang
Life of this patent
Estimating the term…
Abstract
A package is disclosed. The package includes a substrate and an electrical component vertically mounted to the substrate. The electrical component has a first end, a second end vertically spaced from the first end, and a side wall extending from the first end to the second end. The first end of the electrical component is positioned between the substrate and the second end of the electrical component. The package can also include a molding material disposed at least partially along the side wall of the electrical component.
Claims20
A package comprising:
- a substrate;
- an electrical component vertically mounted to the substrate, the electrical component having a longitudinal dimension, a transverse dimension generally perpendicular to the longitudinal dimension, a first end portion, a second end portion vertically spaced from the first portion along the longitudinal dimension of the electrical component, and a side wall extending from the first end portion to the second end portion, the first end portion having a first polarity and positioned between the substrate and the second end portion of the electrical component, the second end portion having a second polarity, the longitudinal dimension being greater than the transverse dimension;
- and
- a molding material disposed at least partially along the side wall of the electrical component.
1 more element
A package comprising:
- a substrate;
- a first component vertically mounted to the substrate, the first component having a long side, a short side shorter than the long side, a first end portion, and a second end portion vertically spaced from the first end portion along the long side, the first end portion of the first component mounted to the substrate and positioned between the substrate and the second end portion of the component;
- a second component vertically mounted to the substrate, the second component having a third end portion and a fourth end portion vertically spaced from the third end portion, the third end portion of the second component mounted to the substrate and positioned between the substrate and the fourth end portion of the second component;
- and
- an interconnect structure electrically connecting the second portion of the first component and the fourth portion of the second component.
2 more elements
A package comprising:
- a substrate;
- and
- an electrical routing means for providing an electrical pathway between a first portion of the substrate and a second portion of the substrate, the electrical routing means comprising:
- a first component vertically mounted to the first portion of the substrate, the first component having a long side, a short side generally perpendicular with the long side, a first terminal, and a second terminal spaced along the long side, the long side of the first component having a dimension greater than the shorter side of the first component, the first component configured to provide a first vertical electrical path from the first portion of the substrate through the first terminal to the second terminal along the long side of the first component;
- a second component vertically mounted to the second portion of the substrate, the second component having a long side, a short side generally perpendicular with the long side, a third terminal, and a fourth terminal spaced along the long side, the long side of the second component having a dimension greater than the short side of second component, the second component configured to provide a second vertical electrical path from the fourth terminal through the third terminal to the second portion of the substrate along the long side of the second component;
- and
- an interconnect electrically coupling the second terminal of the first component and the fourth terminal of the second component, the interconnect configured to provide a lateral electrical path between the first component and the second component.
4 more elements
Dependencies are inferred from the claim text.