Electronic package comprising a decoupling layer structure

A method for manufacturing an electronic package, the method comprising:

• providing a base structure;
• forming a layer stack over the base structure, wherein the layer stack comprises a decoupling layer structure,
• the decoupling layer structure comprising a decoupling material having a Young Modulus being smaller than 1 GPa;
• and
• embedding a component at least partially within the base structure and/or within the layer stack;
• wherein the decoupling material mechanically decouples at least partially one portion of the electronic package formed at one side of the decoupling layer structure from another portion of the electronic package formed at the other side of the decoupling layer structure;
• wherein the decoupling material has a Coefficient of Thermal Expansion, CTE,
• wherein at a temperature smaller than the glass transition temperature the CTE is in the range of between 30 ppm and 200 ppm
• and/or wherein at a temperature larger than the glass transition temperature the CTE is in the range between 25 ppm to 800 ppm;
• wherein the component is embedded into the decoupling material such that the decoupling material is in direct contact with the component at at least three sides of the component.