Bottom ported MEMS microphone with additional port for verification of environmental seal

An electronic device comprising:

• a printed circuit board;
• a bottom-ported microphone package mounted to the printed circuit board, wherein the bottom-ported microphone package includes
• a primary acoustic port positioned adjacent to an acoustic port opening in the printed circuit board and
• an additional acoustic port formed through the package housing of the bottom-ported microphone package;
• an encapsulant coating covering an exterior surface of the package housing of the bottom-ported microphone package;
• and
• a device housing providing a watertight environmental seal for an interior volume of the electronic device, wherein the bottom-ported microphone package is coupled to the device housing at an exterior location outside of the sealed interior volume.

An electronic device comprising:

• a printed circuit board;
• a bottom-ported microphone package mounted to the printed circuit board, wherein the bottom-ported microphone package includes
• a primary acoustic port positioned adjacent to an acoustic port opening in the printed circuit board and
• an additional acoustic port formed through a package housing of the bottom-ported microphone package;
• and
• an encapsulant coating covering an exterior surface of the package housing of the bottom-ported microphone package, wherein the encapsulant coating is a conformal coating formed by dispensing a sealing material in liquid form on the exterior surface of the package housing.