3D-printed protective shell structures with support columns for stress sensitive circuits
AssigneeTexas Instruments Incorporated
InventorsJames Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
Life of this patent
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Abstract
In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.
Claims19
A semiconductor package, comprising:
- a semiconductor die attached to a substrate, wherein the semiconductor die includes a first surface;
- a cured ink covering at least a first portion of the first surface of the semiconductor die;
- a layer of molding compound covering an outer surface of the cured ink and a second portion of the first surface of the semiconductor die;
- and
- a cavity space between an inner surface of the cured ink and the first portion of the first surface of the semiconductor die, wherein the cured ink further comprises one or more support columns.
A semiconductor package, comprising:
- an interposer having a first side and a second side;
- a substrate attached to the second side of the interposer;
- a semiconductor die attached to the first side of the interposer, wherein an exposed surface of the first side of the interposer is not covered by the semiconductor die;
- an ink residue on the exposed surface of the interposer, wherein the ink residue covers a first surface of the semiconductor die;
- at least one support structure contacting the ink residue and the first surface of the semiconductor die;
- and
- a layer of molding compound covering an outer surface of the ink residue and a remaining portion of the exposed surface of the first side of the interposer.
A semiconductor package comprising:
- a semiconductor die having a first surface;
- a cured ink covering a first portion of the first surface of the semiconductor die, wherein the cured ink creates a hermetic seal with the first surface of the semiconductor die;
- and
- at least one support structure contacting the cured ink and the first surface of the semiconductor die, wherein the first portion of the semiconductor die is less than an entire surface of the first surface of the semiconductor die.
Dependencies are inferred from the claim text.