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US 11,082,027 B2Granted
Acoustic wave device
AssigneeTaiyo Yuden Co., Ltd.
InventorMotoi Yamauchi
Life of this patent
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Abstract
An acoustic wave device includes: a first substrate made of a piezoelectric material; an acoustic wave element located on the first substrate; a bump located on the first substrate; a second substrate located on the first substrate through the bump, the second substrate facing the first substrate across an air gap; and a support layer that is located in at least a part of a periphery of the first substrate, is in contact with a side surface of the first substrate, and has a less linear thermal expansion coefficient than the first substrate.
Claims11
An acoustic wave device comprising:
- a piezoelectric substrate made of a piezoelectric material, the piezoelectric substrate having a recess located at a part of a periphery of the piezoelectric substrate;
- an acoustic wave element located on the piezoelectric substrate;
- a bump located on the piezoelectric substrate;
- a first substrate located on the piezoelectric substrate through the bump, the first substrate facing the piezoelectric substrate across an air gap;
- and
- a support layer that is embedded in the recess, is in contact with a side surface of the recess, and has a less linear thermal expansion coefficient than the piezoelectric substrate.
3 more elements
Dependencies are inferred from the claim text.