Power module housing
AssigneeSemiconductor Components Industries, LLC
InventorsJihwan Kim, Yushuang Yao, Bosung Won, Atapol Prajuckamol, Olaf Zschieschang
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AssigneeSemiconductor Components Industries, LLC
InventorsJihwan Kim, Yushuang Yao, Bosung Won, Atapol Prajuckamol, Olaf Zschieschang
Estimating the term…
A housing that can be used for a power module in a power system is disclosed. The housing includes features to improve the insulating properties and to reduce or eliminate a mechanical stress on a housing that could crack or break a substrate contained within the housing. The insulating properties are improved by protrusions that surround apertures for press-fit pins. Each protrusion can increase a creepage for the housing by extending the surface of the housing along a press-fit pin. The mechanical stress is reduced by a mounting flange that includes a wedge surface and a flexible structure that react to a force applied when the mounting flange is fastened to a surface by a fastener.
A power module housing comprising:
A power module comprising:
A housing comprising:
Dependencies are inferred from the claim text.