US 11,081,748 B2Granted

Packaging material for power storage device

AssigneeToppan Printing Co., Ltd.

InventorsHiroshi Dai, Junya Imamoto, Yu Ogihara, Masayoshi Suzuta

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Abstract

Packaging material for a power storage device, comprising at least a substrate layer, an adhesive layer, a metal foil layer and a sealant layer wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler relative to the total thickness of the sealant layer is 5 to 50%, and also to a packaging material for a power storage device, comprising a substrate layer, a barrier layer and also to a packaging material for power storage device, which comprises a substrate layer, a barrier layer and a sealant layer arranged in this order wherein the barrier layer is made of a metal foil and has a corrosion inhibition treatment layer at least at a side of the sealant layer, and the sealant layer is formed directly on the corrosion inhibition layer, has a thickness of 5 to 30 μm, and contains a high melting point material.

Claims6

Dependent claims

A packaging material for power storage device, comprising:

a substrate layer,
an adhesive layer,
a metal foil layer, and
a sealant layer, and,
wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler to a total thickness of the sealant layer in a section along the direction of lamination is 20% to 30% wherein the sealant layer is a three-layer structure comprising a first filler-free layer, an inorganic filler-containing layer and a second filler-free layer, wherein the inorganic filler-containing layer is sandwiched between the first filler-free layer and the second filler-free layer, wherein the inorganic filler-containing layer comprises the inorganic filler, and wherein each of the first-filler free layer and the second-filler free layer is free of the inorganic filler, wherein the first filler-free layer faces the metal foil layer, the first filler-free layer consists of an acid-modified polyolefin resin, and wherein the inorganic filler containing layer has a thickness of not less than 50% of the total thickness of the sealant layer.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/834,275Filed 7 Dec 2017 · continuation
Priority: JP JP2015-11761810 Jun 2015
Published: US 2018/0102514 A112 Apr 2018
Granted: 3 Aug 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification37 codes

B32B 15/20
Layered products comprising a layer of metal: comprising aluminium or copper
B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 15/085
Of synthetic resin: comprising polyolefins
B32B 15/088
Of synthetic resin: comprising polyamides