Resin film for electronic devices, and electronic device

A resin film for an electronic device comprising:

• a resin containing a polymer;
• hygroscopic particles dispersed in the resin and having a primary particle diameter of 200 nm or less;
• and
• a dispersant, wherein
• an absolute value of a difference in refractive index between the resin and the hygroscopic particles is 0.05 or less,
• an amount of the dispersant is 7 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the hygroscopic particles,
• the polymer is a hydrogenated styrene-isoprene-styrene block copolymer in which both an unsaturated bond of isoprene and an aromatic ring are hydrogenated, the polymer having an alkoxysilyl group introduced thereto,
• a ratio (wA/wB) of the weight fraction wA of all of the styrene blocks in the entire block copolymer relative to the weight fraction wB of all of the isoprene blocks in the entire block copolymer is 20/80 or more and 60/40 or less,
• the hygroscopic particles are one or more substances selected from the group consisting of zeolite and hydrotalcite, and
• an acid value or a base value of the dispersant is 20 mgKOH/g or more, and 200 mgKOH/g or less.