OLED encapsulation structure, display device and method for manufacturing OLED encapsulation structure

An OLED encapsulation structure, comprising:

• an OLED device, and
• a plurality of film layers and a buffer layer covering the OLED device from different sides of the OLED device,
• wherein the plurality of film layers comprises inorganic layers and organic layers stacked alternately and contacting surfaces of any two film layers in contact with each other among the plurality of film layers comprise complementary topographies such that the any two film layers in contact with each other are stuck with each other,
• wherein the complementary topographies comprise first semicircular engaging slots on one of the any two film layers in contact with each other and first semicircular engaging protrusions on other one of the any two film layers in contact with each other, wherein the first semicircular engaging slots are separated by flat parts of the one of the any two film layers in contact with each other, the first semicircular engaging protrusions are separated by flat parts of the other one of the any two film layers in contact with each other, the first semicircular engaging protrusions are stuck in the first semicircular engaging slots,
• wherein a shape of a longitudinal section of each of the first semicircular engaging slots and a shape of a longitudinal section of each of the first semicircular engaging protrusions are semicircular shapes, the shape of the longitudinal section of each of the first semicircular engaging slots corresponds to the shape of the longitudinal section of each of first semicircular engaging protrusions, and
• wherein the plurality of film layers comprises first film layers, second film layers and third film layers, the first film layers comprise a film layer closest to the OLED device and a film layer farthest from the OLED device, the second film layers are inorganic layers not belonging to the first film layers, and the third film layers are organic layers not belonging to the first film layers,
• wherein two film surfaces of each of the second film layers are provided with the first semicircular engaging slots, and two film surfaces of each of the third film layers are provided with the first semicircular engaging protrusions,
• wherein the film layer closest to the OLED device is directly stuck with the buffer layer through a first mating mechanism that is located at a terminal of the film layer closest to the OLED device, and each one of the second film layers is directly stuck with the buffer layer through a respective second mating mechanism that is located at a terminal of the each one of the second film layers.