Encapsulation film
AssigneeLG Chem, Ltd.
InventorsHo Joon Yoo, Dong Hwan Ryu, Se Ho Shin, Moon Cheol Shin, Whoon Jeong, Jae Seol Ryu
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Abstract
The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.
Claims23
An encapsulation film for an organic electronic element, the encapsulation film comprising:
- an encapsulation layer comprising a moisture adsorbent;
- a metal layer formed on the encapsulation layer and having a thermal conductivity of 50 to 800 W/m·K;
- a magnetic layer formed on the metal layer and comprising magnetic particles;
- and
- a bright spot inhibitor having an adsorption energy for outgases of 0eV or less as calculated by a density functional theory and present in the encapsulation layer or the magnetic layer.
An encapsulation film for an organic electronic element, the encapsulation film, comprising:
- an encapsulation layer comprising a moisture adsorbent;
- a metal layer formed on the encapsulation layer and having a thermal conductivity of 50 to 800 W/m·K;
- a magnetic layer formed on the metal layer and comprising magnetic particles;
- and
- a metal layer formed on the magnetic layer and having a thermal conductivity of 50 to 800 W/m·K.
Dependencies are inferred from the claim text.